Bangladesh and China have signed a memorandum of understanding (MoU) to deepen collaboration in the semiconductor sector, with a focus on technology transfer, research partnerships, and workforce development.

The agreement, inked in Dhaka on Sunday between the Bangladesh Semiconductor Industry Association (BSIA) and the Hubei Semiconductor Industry Association (HSIA), outlines plans for joint R&D projects, training and certification programmes, and investment opportunities aimed at strengthening Bangladesh’s semiconductor ecosystem.

It also paves the way for trade delegations, academic linkages, and joint industry events.

HSIA Vice President Professor Wei Liu highlighted Wuhan’s technological strength, noting the city hosts hundreds of semiconductor companies and over 60 universities with 1.3 million students.

“Bangladesh has a huge talent pool, which creates opportunities for cooperation in technology exchange, engineer training, and academic collaboration,” he said, adding that HSIA, which represents 500 firms, hopes to bring some to Bangladesh for joint ventures.

BSIA President MA Jabbar hailed the MoU as “a milestone that opens doors for business growth, academic exchange, and technological advancement,” saying it would help Bangladesh move up the global semiconductor value chain.

Academics from BUET and NSU, along with executives from local technology firms, attended the signing ceremony, underscoring growing interest in positioning Bangladesh as a competitive player in the global chip industry.